Modified fluid jet plume characteristics

ABSTRACT

A fluid jet ejection device, a method of making a fluid jet ejection head, and a method of improving the plume characteristics of fluid ejected from the fluid jet ejection head. The pharmaceutical drug delivery device includes a cartridge body; and a fluid jet ejection cartridge disposed in the cartridge body. The fluid jet ejection cartridge contains a fluid and an ejection head attached to the fluid jet ejection cartridge. The ejection head contains a plurality of fluid ejectors thereon and a nozzle plate having a plurality of fluid ejection nozzles therein associated with the plurality of fluid ejectors. At least one of the plurality of fluid ejection nozzles has an orthogonal axial flow path relative to a plane defined by the nozzle plate and at least one of the plurality of fluid ejection nozzles has an angled axial flow path relative to a plane define by the nozzle plate.

TECHNICAL FIELD

The disclosure is directed to fluid jet ejection devices for deliveringfluid mist droplets therefrom and in particular to modified fluid jetplume characteristics for the fluid jet ejection devices.

BACKGROUND AND SUMMARY

Fluid ejection devices have been designed and used to eject ink onto asubstrate. However, new uses for fluid ejection devices continue toevolve. For example, fluid ejection devices may be used for vaporproducing devices for drug delivery, such as nasal, oral, pulmonary,ophthalmic, and wound care application, and for ejecting a variety ofnon-aqueous fluids such as lubricants and fragrances. Many of theforegoing applications require that a droplet mist be ejected from thefluid ejection device. However, conventional fluid ejection devices aredesigned to eject fluid droplets in a straight line toward a substrate.Using a fluid ejection device to provide a mist of fluid droplets isantithetical to the design of conventional fluid ejection devices.

For example, nasal spray devices provide a mist of fluid that isinjected into the nasal cavity. Nasal spray devices have becomeimportant methods for delivering drugs to patients. Such devices aremore convenient to use than the administration of drugs throughintravenous (IV) or injection. Spray devices also provide higherbioavailability of drugs compared to oral administration of drugs. Theabsorption of drugs through spray devices is more rapid compared to theabsorption of drugs administered orally since drugs delivered by nasalspray devices directly enter the blood stream making their effect moreimmediate.

FIG. 1 is a cross sectional view, not to scale, of anatomy of a nasalcavity 10 of a person. A portion of the brain 14 is shown above thenasal cavity 10. An olfactory bulb 14 is disposed between the brain 12and a cribriform plate 16. An olfactory mucosa is below the cribriformplate 16. The nasal cavity also includes a superior turbinate 20, amiddle turbinate 22, respiratory mucosa 24 and an inferior turbinate 26.Item 28 represents the palate. Injection of a pharmaceutical drug mistenters the nasal cavity 10 through the nostrils 30 and squamous mucosa32. In order to achieve proper delivery of drugs to the blood streamusing a nasal spray device, the drugs must be delivered to therespiratory mucosa 24 which is highly vascularized. Two areas that arehighly vascularized are the olfactory region and the respiratory region.The respiratory region contains turbinates which increase the surfacearea available for drug absorption.

It is believed that smaller, lower velocity fluid droplets are best fordeposition of drugs in the nasal cavity 10. Fluid droplets with highinertia will tend to move in a straight line and land at the point onlywhere they are aimed. Fluid droplets with low inertia will be affectedby air resistance and air currents and are more likely to floatthroughout the nasal cavity for more even drug delivery coverage.

Another aspect of spray devices for the delivery of drugs that mayincrease deposition coverage is the plume angle of the fluid droplets. Awider plume angle is believed to provide greater mist formation and thusbetter coverage of drug delivery. Conventional methods for deliveringdrugs via the nasal cavity include medicine droppers, multi-spraybottles with spray tips, single-dose syringes with spray tips, and drypowder systems. Accordingly, conventional drug delivery devices aretypically designed to deliver a specific drug to a nasal cavity and eachdevice cannot be adapted for delivering a wide range of drugs via anasal cavity route. Many of the conventional methods for nasal drugdelivery rely on pressurized containers to inject a mist of fluid intothe nasal cavity. Accordingly, the drug delivery devices are typicallydesigned for a specific drug and cannot be adapted to administer adifferent drug.

Despite the availability of a variety of devices for delivering a mistof fluids, there remains a need for a fluid mist ejection device thatcan be tuned to deliver a variety of fluids over a range of velocities,fluid ejection times, and plume angles.

In view of the foregoing an embodiments of the disclosure provide afluid jet ejection device, a method of making a fluid jet ejection head,and a method of improving the plume characteristics of fluid ejectedfrom the fluid jet ejection head. The fluid jet ejection device includesa cartridge body; and a fluid jet ejection cartridge disposed in thecartridge body. The fluid jet ejection cartridge contains a fluid and anejection head attached to the fluid jet ejection cartridge. The ejectionhead contains a plurality of fluid ejectors thereon and a nozzle platehaving a plurality of fluid ejection nozzles therein associated with theplurality of fluid ejectors. At least one of the plurality of fluidejection nozzles has an orthogonal axial flow path relative to a planedefined by the nozzle plate and at least one of the plurality of fluidejection nozzles has an angled axial flow path relative to a planedefine by the nozzle plate.

In another embodiment there is provided a method of making an ejectionhead. The method includes providing a semiconductor substrate having aplurality of fluid ejectors thereon. A fluid flow layer is applied tothe semiconductor substrate. Fluid channels and fluid chambers areimaged and developed in the fluid flow layer. A fluid supply via isetched through the semiconductor substrate. A first nozzle plate layeris applied to the fluid flow layer. The first nozzle plate layer isimaged and developed to provide a first plurality of nozzle holestherein. A second nozzle plate layer is applied to the first nozzleplate layer. The second nozzle plate layer is imaged and developed toprovide a second plurality of nozzle holes therein, wherein at least aportion of the second plurality of nozzle holes are offset from thefirst plurality of nozzle holes.

Another embodiment provides a method for improving plume characteristicsof fluid ejected from a fluid jet ejection head. The method includesapplying a first nozzle plate layer to a fluid flow layer on an ejectionhead substrate; imaging and developing the first nozzle plate layer toprovide a first plurality of nozzle holes therein; applying a secondnozzle plate layer to the first nozzle plate layer; imaging anddeveloping the second nozzle plate layer to provide a second pluralityof nozzle holes therein, wherein at least a portion of the secondplurality of nozzle holes are offset from the first plurality of nozzleholes; and ejecting fluid from the ejection head through the first andsecond nozzle plate layers.

In some embodiments, the first nozzle plate layer and second nozzleplate layer comprise laminated photoresist material layers.

In some embodiments, the first nozzle plate layer is laminated to a flowfeature layer for the ejection head.

In some embodiments, the first nozzle plate layer has a thicknessranging from about 5 to about 30 microns.

In some embodiments, the second nozzle plate layer has a thicknessranging from about 5 to about 30 microns.

In some embodiments, the angled axial flow path is provided by a secondnozzle plate layer attached to a first nozzle plate layer.

In some embodiments, the portion of offset nozzle holes provides anangular discharge of fluid droplets relative to a plane defined by thesecond nozzle plate layer.

An advantage of the device described herein is that the device may beused for a wide variety of fluids having different fluidcharacteristics. The device may be operated to provide a variety ofplume angles by alternately or simultaneously activating fluid ejectorsto eject fluid from fluid ejection nozzles having orthogonal and angledfluid flow paths.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional representation, not to scale, of a portionof a nasal cavity and scull of a person.

FIG. 2 is a cross-sectional view, not to scale of a pharmaceutical drugdelivery device according to an embodiment of the disclosure.

FIG. 3 is a schematic illustration of an ejection device showing a fluidjet stream and a droplet plume generated by fluid droplet ejection froman ejection head.

FIG. 4 is a schematic cross-sectional view, not to scale, of a portionof a prior art ejection head.

FIG. 5 is a plan view, not to scale, of a prior art ejection head andnozzle plate showing details of a flow feature layer on a semiconductorsubstrate.

FIG. 6 is a schematic cross-sectional view, not to scale, of a portionof an ejection head according to the disclosure.

FIGS. 7-10 are schematic illustrations of a process for making anejection head according to an embodiment of the disclosure.

FIG. 11 is a plan view of a portion of a nozzle plate, not to scale,showing offset nozzle holes through first and second nozzle platelayers.

FIG. 12 is a schematic cross-sectional view, not to scale, of theejection head made by the process illustrated in FIGS. 6-9 .

FIGS. 13 and 14 are elarged views, not to scale, of portions of theejection head of FIG. 11 .

DETAILED DESCRIPTION

For the purposes of this disclosure, the following terms are defined:

-   -   a) plume means the randomly directed mist of fluid droplets with        low inertia that are affected by air resistance and air currents        and are likely to float throughout a nasal chamber for more even        coverage;    -   b) plume angle is a measure of an angle of a cone-shaped volume        of randomly directed mist of fluid droplets in the plume;    -   c) plume height is a measure of a total height of mist of fluid        droplets in a plume measured from an outlet of a fluid ejection        head to a total travel distance of the plume;    -   d) fluid jet length is a measure of a length of high inertia        fluid droplets ejected from an outlet of an ejection head to the        apex of the plume angle;    -   e) burst is defined as the number of times a fluid droplet is        ejected from an individual nozzle. A burst of fluid occurs when        a fluid ejector is fired by a series of voltage pulses of        sufficient magnitude to eject fluid through an associated        nozzle;    -   f) burst length is defined as the total number of times each of        the fluid ejectors is fired per burst;    -   g) burst delay is defined as amount of time between individual        bursts; and    -   h) offset nozzle holes means that a center of a nozzle hole in a        first nozzle plate layer is offset a predetermined amount from a        center of a nozzle hole in an adjacent second nozzle plate layer

An illustration of fluid jet ejection device 100 is illustrated in across-sectional view, not to scale, in FIG. 2 . The device includes acartridge body 102, having a fluid outlet nozzle 104 attached to thecartridge body 102. A fluid jet ejection cartridge 106 is disposed inthe cartridge body 102. The fluid jet ejection cartridge 106 contains afluid to be dispensed by the device 100. A logic board 108 is disposedin cartridge body 102 and is electrically connected via a logic boardconnector 110 to an ejection head 112 on the fluid jet ejectioncartridge 106. As described in more detail below, the ejection head 112includes plurality of fluid ejection nozzles and associated fluidejectors. A processor 114 is disposed on the logic board 108 or on theejection head 112 for executing a control algorithm to control theejection head 112 to modify plume characteristics of fluid ejected fromthe ejection head by controlling which fluid ejectors are activated. Thecartridge body 102 may include a rechargeable battery 116 electricallyconnected to the logic board 108 for providing power to the ejectionhead 112. A power switch 118 is used to activate the device 100. A USBinput 120 may also be included to reprogram the processor for use withdifferent pharmaceutical fluids. An activation button 122 may be used toinitiate delivery of fluid droplet mist on-demand by a user.

A wide variety of ejection heads 112 may be used with the device 100described above. Accordingly, the ejection head 112 may be selected froma thermal jet ejection head, a bubble jet ejection head, or apiezoelectric jet ejection head. Each of the foregoing ejection headscan produce a spray of fluid on demand and may be programmed to providea variety of fluid plume characteristics as described below.

Unlike conventional inkjet ejection heads which are designed to ejectfluid droplets in a straight line for 2 to 3 mm to reach a substratesuch as paper, the device 100 described herein is designed to ejectfluid droplets as a mist further into an air stream. When the fluid jetejection device 100 is used as a nasal spray device, the mist of fluiddroplets preferably land in the mucosa area of the nasal cavity. FIG. 3is a schematic illustration of fluid jet ejection device 200 having anejection head 202 for ejecting fluid therefrom to form a relatively highvelocity fluid jet stream 204 and a low velocity plume 206 of fluid mistthat floats on ambient air currents. The plume 206 characteristics, suchas plume height PH and plume angle PA as well as the fluid jet streamlength IL may be affected by how the ejection head 202 is operated. Forexample, a wider plume 206 may be the result of collisions betweendroplets as they are ejected from the ejection head 202. Anothercharacteristics that effects the plume 206 is the entrainment of fluiddroplets from the ejection head 202. High velocity fluid droplets tendto create an airflow perpendicular to the ejection head 202 whichentrains subsequent droplets ejected from the ejection head 202 to drawthe droplets further from the ejection head. 202. Accordingly, airentrainment can affect both the fluid jet stream 204 and the plume 206.

Without desiring to be bound by theoretical considerations, it isbelieved that the fluid droplet angle relative to a plane defined by thenozzle plate can affect the plume angle (PA). The angled fluid dropletsare believed to interact in the air stream with other fluid droplets.The interaction of fluid droplets with different angular trajectoriescauses a wider plume angle. A wider plume angle is believed to providegreater mist formation for fluid droplet impact over a wider targetarea.

With reference to FIG. 4 , there is illustrated a schematiccross-sectional view of an ejection head 300 having a single layernozzle plate 302 with a thickness T attached to a flow feature layer304. The flow feature layer 304 includes a fluid flow channel 306 fordirecting fluid from a fluid supply via 308 in a semiconductor substrate310 to a fluid chamber 312. The fluid chamber 312 includes a fluidejector 314 for ejecting fluid through a nozzle hole 316 in the nozzleplate 302. A flow path through the nozzle hole 316 is indicated by arrow318 which is orthogonal to a plane defined by the surface 320 of thenozzle plate 302.

A plan view of the ejection head is illustrated in FIG. 5 illustrating aplurality of nozzle holes 316 disposed on both sides of the fluid supplyvia 308. The fluid ejectors can be activated simultaneously,sequentially, alternately, or in pre-determined groups to provide fluiddroplets for mist formation as described above. Even if the fluidejector parameters such as frequency, pulse width, burst length, orburst delay are modified, the modification ranges for these parametersfor a conventional fluid ejection head may not enough to obtain thedesired plume characteristics.

Accordingly, the disclosure provides an ejection head containing aplurality of nozzle holes wherein at least one nozzle hole has anorthogonal axial flow path length and at least one nozzle hole has anangled axial flow path length is provided. An ejection head 434according to the disclosure is illustrated in FIG. 6 . By combining oneor more nozzle holes 422/432 having an angled axial flow path (arrow436) with one or more nozzle holes 434 have an orthogonal axial flowpath (arrow 438), interaction between droplets ejected from the ejectionhead is increased thereby producing a wider plume angle. The orthogonalaxial flow nozzles 434 and the angled axial flow nozzles 422/432 can beadjacent to one another or on opposite sides of the fluid supply via 406and may be activated simultaneously, sequentially, alternately, or inpre-determined groups to produce increased interaction between fluiddroplets in the air stream.

The ejection head according to the disclosure is made by applying afirst nozzle plate layer 400 to a flow feature layer 402 that isattached to a semiconductor substrate 404 as shown in FIG. 7 . The flowfeature layer 402 is a photoimageable material, such as a negativephotoresist material, that is spin coated or laminated to thesemiconductor substrate 404 prior to forming a fluid supply via 406 inthe semiconductor substrate 404. The flow feature layer 402 includes afluid flow channel 408 for directing fluid from the fluid supply via 406to a fluid chamber 410 that includes a fluid ejector 412 and may have athickness ranging from about 10 to about 60 microns. Once the fluidchamber 410 and fluid flow channel 408 are imaged and developed in theflow feature layer 402, and the fluid supply channel is etched throughthe semiconductor substrate 404, the first nozzle plate layer 400 islaminated to the flow feature layer 402. The first nozzle plate layer400 may have a thickness ranging from about 5 to about 30 microns andmay be a photoimageable material such as a negative photoresistmaterial.

In the next step of the process, as shown in FIG. 8 , a mask 414 havingopaque areas 416 and transparent areas 418 is used to image nozzle holeshaving the first axial flow path length in the first nozzle layer 400using actinic radiation such as ultraviolet (UV) light indicated byarrows 420. After imaging the first nozzle plate layer 400, the firstnozzle plate layer is developed to provide the nozzle holes 422.

In FIG. 9 , a second nozzle plate layer 424 is laminated to the firstnozzle plate layer 400. Like the first nozzle plate layer 400, thesecond nozzle plate layer may be a negative photoresist material havinga thickness ranging from about 5 to about 30 microns. Next, a mask 426containing opaque areas 428 and transparent areas 430 is used to imagenozzle holes in the second nozzle plate layer 424 (FIG. 10 ). As shownin FIG. 11 , the center of nozzle holes 422 in the first nozzle platelayer 400 are offset from the center of nozzle holes 432 in the secondnozzle plate layer 424. However, the centers of some of the nozzle holes434 in both the first nozzle plate layer 400 and the second nozzle platelayer 424 coincide so that there is no offset. As shown in FIG. 12 , theoffset nozzle holes 422/432 cause fluid to be ejected from the nozzleholes 422/432 at an angle as shown by arrow 436. FIG. 12 also shows anozzle hole 434 wherein fluid is ejected orthogonal to a plane definedby the combined nozzle plate layers 400 and 424 as illustrated by arrow438. FIGS. 13 and 14 are enlarged views of the nozzle holes 432/422 and434. The angle 440 in FIG. 13 may range from about 45 degrees to about89 degrees with respect to a plane 442 defined by the nozzle platelayers 400 and 424. In FIG. 14 , the angle 444 is 90 degrees withrespect to the plane 442.

The photoresist materials that may be used for making the first andsecond nozzle plate layers 400 and 424 typically contain photoacidgenerators and may be formulated to include one or more of amulti-functional epoxy compound, a di-functional epoxy compound, arelatively high molecular weight polyhydroxy ether, an adhesionenhancer, an aliphatic ketone solvent, and optionally a hydrophobicityagent. For purposes of the disclosure, “difunctional epoxy” means epoxycompounds and materials having only two epoxy functional groups in themolecule. “Multifunctional epoxy” means epoxy compounds and materialshaving more than two epoxy functional groups in the molecule.

An epoxy component for making a photoresist formulation according to thedisclosure, may be selected from aromatic epoxides such as glycidylethers of polyphenols. An exemplary first multi-functional epoxy resinis a polyglycidyl ether of a phenolformaldehyde novolac resin such as anovolac epoxy resin having an epoxide gram equivalent weight rangingfrom about 190 to about 250 and a viscosity at 130° C. ranging fromabout 10 to about 60.

The multi-functional epoxy component may have a weight average molecularweight of about 3,000 to about 5,000 Daltons as determined by gelpermeation chromatography, and an average epoxide group functionality ofgreater than 3, preferably from about 6 to about 10. The amount ofmultifunctional epoxy resin in a photoresist formulation may range fromabout 30 to about 50 percent by weight based on the weight of the driedphotoresist layer.

The di-functional epoxy component may be selected from di-functionalepoxy compounds which include diglycidyl ethers of bisphenol-A,3,4-epoxycyclohexylmethyl-3,4-epoxycyclo-hexene carboxylate,3,4-epoxy-6-methylcyclohexylmethyl-3,4-epoxy-6-methylcy-clohexenecarboxylate, bis(3,4-epoxy-6-methylcyclohexylmethyl) adipate, andbis(2,3-epoxycyclopentyl) ether.

An exemplary di-functional epoxy component is abisphenol-A/epichlorohydrin epoxy resin having an epoxide equivalent ofgreater than about 1000. An “epoxide equivalent” is the number of gramsof resin containing 1 gram-equivalent of epoxide. The weight averagemolecular weight of the di-functional epoxy component is typically above2500 Daltons, e.g., from about 2800 to about 3500 weight averagemolecular weight. The amount of the first di-functional epoxy componentin a photoresist formulation may range from about 30 to about 50 percentby weight based on the weight of the cured resin.

Exemplary photoacid generators include compounds or mixture of compoundscapable of generating a cation such as an aromatic complex salt whichmay be selected from onium salts of a Group VA element, onium salts of aGroup VIA element, and aromatic halonium salts. Aromatic complex salts,upon being exposed to ultraviolet radiation or electron beamirradiation, are capable of generating acid moieties which initiatereactions with epoxides. The photoacid generator may be present in thephotoresist formulations described herein in an amount ranging fromabout 5 to about 15 weight percent based on the weight of the curedresin.

Compounds that generate a protic acid when irradiated by active rays,may be used as the photoacid generator, including, but are not limitedto, aromatic iodonium complex salts and aromatic sulfonium complexsalts. Examples include di-(t-butylphenyl)iodonium triflate,diphenyliodonium tetrakis(pentafluorophenyl)borate, diphenyliodoniumhexafluorophosphate, diphenyliodonium hexafluoroantimonate,di(4-nonylphenyl)iodonium hexafluorophosphate,[4-(octyloxy)phenyl]phenyliodonium hexafluoroantimonate,triphenylsulfonium triflate, triphenyl-sulfonium hexafluorophosphate,triphenylsulfonium hexafluoroantimonate, triphenylsulfoniumtetrakis(pentafluorophenyl)borate,4,4′-bis[diphenylsulfonium]diphenylsulfide, bis-hexafluoro-phosphate,4,4′-bis[di([beta]-hydroxyethoxy)phenylsulfonium]diphenylsulfidebis-hexafluoro-antimonate,4,4′-bis[di([beta]-hydroxyethoxy)(phenylsulfonium)diphenylsulfide-bishexafluoro-phosphate7-[di(p-tolyl)sulfonium]-2-isopropylthioxanthone hexafluorophosphate,7-[di(p-tolyl)sulfonio-2-isopropylthioxanthone hexafluoroantimonate,7-[di(p-tolyl)sulfonium]-2-isopropyl tetrakis(pentafluorophenyl)borate,phenylcarbonyl-4′-diphenylsulfonium diphenyl-sulfidehexafluorophosphate, phenylcarbonyl-4′-diphenylsulfonium diphenylsulfidehexafluoroantimonate, 4-tert-butylphenylcarbonyl-4′-diphenylsulfoniumdiphenylsulfide hexafluorophosphate,4-tert-butylphenylcarbonyl-4′-diphenylsulfonium diphenylsulfidehexafluoroantimonate, 4-tert-butylphenylcarbonyl-4′-diphenylsulfoniumdiphenylsulfide tetrakis(pentafluorophenyl)borate, diphenyl[4-(phenylthio)phenyl] sulfonium hexafluoro-antimonate and the like.

A solvent for use in preparing photoresist formulations is a solventwhich is non-photoreactive. Non-photoreactive solvents include, but arenot limited gamma-butyrolactone, C₁₋₆ acetates, tetrahydrofuran, lowmolecular weight ketones, mixtures thereof and the like. Thenon-photoreactive solvent is present in the formulation mixture used toprovide the nozzle plate layers 400 and 424 in an amount ranging fromabout 20 to about 90 weight percent, such as from about 40 to about 60weight percent, based on the total weight of the photoresistformulation. The non-photoreactive solvent typically does not remain inthe cured composite film layer and is thus removed prior to or duringthe composite film layer curing steps.

The photoresist formulation may optionally include an effective amountof an adhesion enhancing agent such as a silane compound. Silanecompounds that are compatible with the components of the photoresistformulation typically have a functional group capable of reacting withat least one member selected from the group consisting of themultifunctional epoxy compound, the difunctional epoxy compound and thephotoinitiator. Such an adhesion enhancing agent may be a silane with anepoxide functional group such as 3-(guanidinyl)propyltrimethoxysilane,and a glycidoxyalkyltrialkoxysilane, e.g.,gamma-glycidoxypropyltrimethoxysilane. When used, the adhesion enhancingagent can be present in an amount ranging from about 0.5 to about 2weight percent, such as from about 1.0 to about 1.5 weight percent basedon total weight of the cured resin, including all ranges subsumedtherein. Adhesion enhancing agents, as used herein, are defined to meanorganic materials soluble in the photoresist composition which assistthe film forming and adhesion characteristics of the photoresistmaterials.

Another optional component that may be used in the photoresistformulations for the nozzle plate layers includes a hydrophobicityagent. The hydrophobicity agent that may be used includes siliconcontaining materials such as silanes and siloxanes. Accordingly, thehydrophobicity agent may be selected fromheptadecafluorodecyltrimethoxysilane, octadecyldimethylchlorosilane,ocatadecyltricholorsilane, methytrimethoxysilane, octyltriethoxysilane,phenyltrimethoxysilane, t-butylmethoxysilane, tetraethoxysilane, sodiummethyl siliconate, vinytrimethoxysilane,N-(3-(trimethoxylsilyl)propyl)ethylenediamine polymethylmethoxysiloxane,polydimethylsiloxane, polyethylhydrogensiloxane, and dimethyl siloxane.The amount of hydrophobicity agent in the photoresist layers 400 and 424may range from about 0.5 to about 2 weight percent, such as from about1.0 to about 1.5 weight percent based on total weight of the curedresin, including all ranges subsumed therein.

While the foregoing disclosure provides nozzle plate layers 400 and 424made of photoresist materials, the first and second nozzle plate layersare not limited to photoresist material layers. Other materials such aspolyimide materials may be used to provide the first and second nozzleplate layers 400 and 424 and nozzle holes therein as described above.

It is noted that, as used in this specification and the appended claims,the singular forms “a,” “an,” and “the,” include plural referents unlessexpressly and unequivocally limited to one referent. As used herein, theterm “include” and its grammatical variants are intended to benon-limiting, such that recitation of items in a list is not to theexclusion of other like items that can be substituted or added to thelisted items.

For the purposes of this specification and appended claims, unlessotherwise indicated, all numbers expressing quantities, percentages orproportions, and other numerical values used in the specification andclaims, are to be understood as being modified in all instances by theterm “about.” Accordingly, unless indicated to the contrary, thenumerical parameters set forth in the following specification andattached claims are approximations that can vary depending upon thedesired properties sought to be obtained by the present disclosure. Atthe very least, and not as an attempt to limit the application of thedoctrine of equivalents to the scope of the claims, each numericalparameter should at least be construed in light of the number ofreported significant digits and by applying ordinary roundingtechniques.

While particular embodiments have been described, alternatives,modifications, variations, improvements, and substantial equivalentsthat are or can be presently unforeseen can arise to applicants orothers skilled in the art. Accordingly, the appended claims as filed andas they can be amended are intended to embrace all such alternatives,modifications variations, improvements, and substantial equivalents.

What is claimed is:
 1. A fluid jet ejection device comprising: a cartridge body; a fluid outlet nozzle attached to the cartridge body; a fluid jet ejection cartridge disposed in the cartridge body, the fluid jet ejection cartridge containing a fluid and an ejection head attached to the fluid jet ejection cartridge; wherein the ejection head contains a plurality of fluid ejectors thereon and a nozzle plate having a plurality of fluid ejection nozzles therein associated with the plurality of fluid ejectors, wherein at least one of the plurality of fluid ejection nozzles has an orthogonal axial flow path relative to a plane defined by the nozzle plate and at least one of the plurality of fluid ejection nozzles has an angled axial flow path relative to a plane define by the nozzle plate, wherein the angled axial flow path is configured to increase interaction between fluid droplets and is provided by a second nozzle plate layer attached to a first nozzle plate layer and wherein the first nozzle plate layer and second nozzle plate layer comprise laminated photoresist material layers.
 2. The fluid jet ejection device of claim 1, wherein the first nozzle plate layer has a thickness ranging from about 5 to about 30 microns.
 3. The fluid jet ejection device of claim 1, wherein the second nozzle plate layer has a thickness ranging from about 5 to about 30 microns.
 4. The fluid jet ejection device of claim 1, wherein the first nozzle plate layer is laminated to a flow feature layer for the ejection head.
 5. A method of making an ejection head, the method comprising: providing a semiconductor substrate having a plurality of fluid ejectors thereon; applying a fluid flow layer to the semiconductor substrate; imaging and developing fluid channels and fluid chambers in the fluid flow layer; etching a fluid supply via through the semiconductor substrate; laminating a first photoresist nozzle plate layer to the fluid flow layer; imaging and developing the first photoresist nozzle plate layer to provide a first plurality of nozzle holes therein; laminating a second photoresist nozzle plate layer to the first photoresist nozzle plate layer; imaging and developing the second photoresist nozzle plate layer to provide a second plurality of nozzle holes therein, wherein at least a portion of the second plurality of nozzle holes are offset from the first plurality of nozzle holes.
 6. The method of claim 5, wherein the first photoresist nozzle plate layer has a thickness ranging from about 5 to about 30 microns.
 7. The method of claim 5, wherein the second photoresist nozzle plate layer has a thickness ranging from about 5 to about 30 microns.
 8. The method of claim 5, wherein the portion of offset nozzle holes provides an angular discharge of fluid droplets relative to a plane defined by the second photoresist nozzle plate layer.
 9. A method for improving plume characteristics of fluid ejected from a fluid jet ejection head, comprising: laminating a first photoresist nozzle plate layer to a fluid flow layer on an ejection head substrate; imaging and developing the first photoresist nozzle plate layer to provide a first plurality of nozzle holes therein; laminating a second photoresist nozzle plate layer to the first photoresist nozzle plate layer; imaging and developing the second photoresist nozzle plate layer to provide a second plurality of nozzle holes therein, wherein at least a portion of the second plurality of nozzle holes are offset from the first plurality of nozzle holes; and ejecting fluid from the ejection head through the first and second photoresist nozzle plate layers.
 10. The method of claim 9, wherein the first photoresist nozzle plate layer has a thickness ranging from about 5 to about 30 microns.
 11. The method of claim 9, wherein the second photoresist nozzle plate layer has a thickness ranging from about 5 to about 30 microns. 